34.1 Introduction 34.2 Design Entry 34.3 Synthesis 34.4 Verification Timing Analysis. Simulation.Analog Simulation.Emulation 34.5 Physical Design

33.1 Introduction Motivation .Requirements 33.2 Heat Transfer Fundamentals Avram Bar-Cohen 33.3 Chip Module Thermal Resistance Definition. Internal Resistance. External Resistance.Total

国家开放大学：2015年春季学期“开放专科”道路桥梁工程施工与管理专业地基基础期末试题（7月）

国家开放大学：2014年秋季学期“开放专科”道路桥梁工程施工与管理专业地基基础期末试题（1月）

30.1 Power Semiconductor Devices Thyristor and Triac. Gate Turn-Off Thyristor(GTO). Reverse- Conducting Thyristor(RCT) and Asymmetrical Silicon-Controlled Rectifier (ASCR). Power Transistor Power MOSFET. Insulated-Gate Bipolar Transistor (IGBT). MOS Controlled

28.1 Large Signal Analysis DC Operating Point. Graphical Approach.Power Amplifiers Gordon. Carpenter 28.2 Small Signal Analysis California State University. Hybrid-Pi Equivalent Circuit. Hybrid-Pi Equivalent Circuit of a Long Beach

26.1Introduction 26.2 Definition and Considerations Considerations in the Implementation of SMT 26.3 SMT Design, Assembly, and Test Overview

25.1 Integrated Circuit Technology Technology Perspectives. Technology Generations.National Technology Roadmap for Semiconductors Joe E.Brewer 25.2 Layout, Placement, and Routing Northrop Grumman Corporation What Is Layout?. Floorplanning Techniques.Placement

Digital Devices 79 Logic Elements G. L. Moss P. Graham, R.S. Sandige, H.S. Hinto IC Logic Family Operation and Characteristics. Logic Gates (IC). Bistable Devices.Optical Devices

Oklobdzija,. C. Hamacher, Z. G. Vranesic, S. G. Zaky, J. Raymond Number Systems· Computer Arithmetic Architecture·Microprogramming 87 Programming J. M. Feldman, E. W. Czeck,. G. Lewis, J. J.Martin Assembly Language. High-Level Languages. Data Types and Data Structures