辽宁工业大学：《化工分离过程》课程教学大纲 Chemical Seperation Process

四川大学：材料成型及控制工程系课程教学资源《材料成型过程数值仿真模拟》教学大纲 Digital Simulation of Material Forming process

CHAPTER 6 DEFINING THE ORGANIZATION’S STRATEGIC DIRECTION CHAPTER 7 CHOOSING INNOVATION PROJECTS Chapter 8 COLLABORATION STRATEGIES Chapter 9 PROTECTING INNOVATION Chapter 10 ORGANIZING FOR INNOVATION Chapter 11 MANAGING THE NEW PRODUCT DEVELOPMENT PROCESS Chapter 12 MANAGING NEW PRODUCT DEVELOPMENT TEAMS

• Meaning of Risk Management • Objectives of Risk Management • Steps in the RM Process • Benefits of Risk Management • Personal RM • Corporate RM – ERM （FMEA）

• 分布式实时系统 – Leslie Lamport • “A system is distributed if the message transmission delay is not negligible compared to the time between events in a single process.” [Lam78b]. • Real-Time Systems and Dependable Systems – Temporal properties • Timing constraints on interface, including ordering restrictions • 分布式通信协议 – OSI collapsed model – LIN/CAN • 时间同步 • TTP协议 • H. Kopetz. • P. Veríssimo and L. Rodríguez

1.Design Process 2.E-R Model 3.E-R Diagram 4.Advanced Topics 5.Reduction to Relation Schemas 6.Database Design 7.UML

第一节 模板和酶 Templates and Enzymes 第二节 转录过程 The Process of Transcription 第三节 真核生物的转录后修饰 Post-transcriptional Modification

1 Methods for Generating Random Variables 1.1 Generating Uniform(0,1) random number 1.2 Random Generators of Common Probability Distribution in R 1.2.1 The Inverse Transform Method 1.2.2 The Acceptance-Rejection Method 1.2.3 Transformation Methods 1.2.4 Sums and Mixtures 1.3 Multivariate Distribution 1.3.1 Multivariate Normal Distribution 1.3.2 Mixtures of Multivariate Normals 1.3.3 Wishart Distribution 1.3.4 Uniform Distribution on the d−Sphere 1.4 Stochastic Process

《金融投资学》教学资源（英文文献）How Markets Process Information

1.1 About Digital Design(关于 “ 数字设计 ”) 1.2 Analog versus Digital(模拟与数字) 1.3 Digital Devices(数字器件) 1.4 Electronic Aspects of Digital Design(数字设计的电子技术) 1.5 Software Aspects of Digital Design(数字设计的软件技术) 1.6 Integrated Circuits（集成电路，IC） 1.7 Programmable Logic Devices(可编程逻辑器件)  Programmable Logic Array(PLA, 可编程逻辑阵列)  Programmable Array Logic (PAL, 可编程阵列逻辑)  Programmable Logic Device(PLD, 可编程逻辑器件)  Complex PLD (CPLD, 复杂可编程逻辑器件)  Field-Programmable Gate Array(FPGA, 现场可编程门阵列） Digital Logic Design and Application (数字逻辑设计及应用) 1.8 Application-Specific ICs[专用集成电路（ASIC）] 1.9 Printed-Circuit Boards(PCB, 印制电路板) 1.10 Digital Design Levels（数字设计层次）  Device Physics Level (器件物理层）  IC Manufacturing Process Level（IC 制造过程级）  Transistor Level (晶体管级）  Gates Structure Level (门电路结构级）  Logic Design Level （逻辑设计级）  Overall System Design（整体系统设计） Digital Logic Design and Application (数字逻辑设计及应用)