点击切换搜索课件文库搜索结果(80)
文档格式:PDF 文档大小:110.42KB 文档页数:14
Microelectronics letters journals IEEE Electron Device letters Applied physics Letters Available online at libraries mit edu Click on vera (Virtual Electronic Resource Access)
文档格式:PDF 文档大小:25.51KB 文档页数:2
In this lab session, the cantilever and fixed-fixed beams will be mechanically tested to determ material and device performance characteristics. The structures will be mechanically loaded the corresponding deflection measured. From the load versus deflection curves, an effective
文档格式:PDF 文档大小:14.67KB 文档页数:3
5.1 Defining the Clinical Problem 5.2 Anatomical Considerations 5.3 Biomechanical Considerations 5.4 Functional Requirements 5.5 Goodness of Fit 5.6 Fixation
文档格式:PDF 文档大小:26.78KB 文档页数:6
1.1 Objectives of Subject 1.2 Related Subjects at MIT 1.3 Terminology 1.4 How Selected Tissues/Organs Function 1.5 Effects of Trauma and Disease on Function 1.6 Restoration of Function with Implants 1.7 Applications of Medial Devices and Examples Demonstrating the Successful and Unsuccessful Performance of Medical Devices/Implants 1.8 Design Considerations for Medical Devices and Non-medical Structures
文档格式:PDF 文档大小:9.3KB 文档页数:1
6.1 Performance Specifications 6.2 Biocompatibility 6.3 Degradation 6.4 Risk/Benefit Ratio 6.5 Clinical Trial Design
文档格式:PDF 文档大小:43.57KB 文档页数:12
8.1 Biomaterials: Relative Properties 8.2 Bulk(Mechanical) and Surface Properties 8.3 Reactivity: Molecular Interactions 8.4 Bioadhesion (Tissue Bonding): Physical and Chemical Mechanisms 8.5 Factors Affecting Biomaterials
文档格式:PDF 文档大小:63.8KB 文档页数:11
Package integrity is an essential requirement for maintaining the high quality of, for example, sterilised foods and modified atmosphere packaged foods. The increasing focus on quality assurance is putting demands on verification of food package integrity. The foremost noticeable package integrity problem is probably leaking seals, particularly with flexible plastic packages which are more prone to mechanical damage than traditional rigid metal packages. A non- destructive leak test device allowing evaluation of every container produced is. therefore, of interest to food manufacturers
文档格式:PDF 文档大小:323.08KB 文档页数:5
22 Semiconductors G.S. Gildenblat, B. Gelmont, M. Milkovic, A. Elshabini-Riad, F.W. Stephenson, I.A. Bhutta, D.C. Look Physical Properties. Diodes. Electrical Equivalent Circuit Models and Device Simulators for Semiconductor Devices Electrical Characterization of Semiconductors
文档格式:PDF 文档大小:262.06KB 文档页数:24
EDA(Electronic Design Automation) ASIC(Application Specific Integrated Circuit) FPGA(Field Programmable Gate-Array) CPLD(Complex Programmable Logic Device) SOC(System On a Chip) IP(Intellectual Property) ISP(In-System Programmable )
文档格式:PPT 文档大小:1.4MB 文档页数:65
The first three types of control devices we consider--gravity settlers, cyclone separators, and electrostatic precipitators--all function by driving the particles to a solid wall, where they adhere to each other to form agglomerates that can be removed from the collection device and disposed of
上页12345678下页
热门关键字
搜索一下,找到相关课件或文库资源 80 个  
©2008-现在 cucdc.com 高等教育资讯网 版权所有