集成电路的发展 FIRST MICROPROCESSOR PENTIUM 4 (4004 by Intel 1971) 0. 18um 42 million components 1.7 GHz
集成电路的发展
集成电路的发展 TAL Metal Metal 3 Actual cross-section of a modern microprocessor chip. Note the multiple levels of metal and the planarization
5 集成电路的发展
CMOS: Standard Metallization TITIN TIN, ARC TiS 补偿性超效应晶 Metal 1. Al-Cu 体管器件结构剖 面示意图 BPSG P- Well N-Well P-wafer 芯片多层互联线芯片互联结构实 结构剖面示意图 物照片 Passivation 2 Passivation 1 AlCu Allov Al-Cu USG Metal IMD 3 USG TiTIN TIN ARCI Metal 3 AI.Cu Allov Applications: Interconnection T IMD 2 USG Clobal USG Contant Sidewall BPSG Local Word interconnect P- Wafer
补偿性超效应晶 体管器件结构剖 面示意图 芯片多层互联线 结构剖面示意图 芯片互联结构实 物照片
双极型晶体管原理 ADD BORON ( B)TO GET P DOPED REGION UNBOUND ELECTRONS CURRENT FLOW ELECTRON FLOW 000.0 FORWARD BIASED JUNCTION ALLOWS CURRENT FLOW 000 DEPLETION REGION ABSENCE OF ELECTRONS OR"HOLES PHOSPHOROUS DOPIN ELECTRON FLOW CURRENT FLOW P-N JUNCTION REVERSE BIASED JUNCTION 电子材料与器件工艺一绪论
电子材料与器件工艺-绪论 7 双极型晶体管原理
双极型晶体管工艺 NPN Bipolar Transistor Emitter Base Collector Al Cu S 删影要败解 n n-ep Electron flo n buried laver P-substrate COLLECTOR
双极型晶体管工艺