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1. 试论述差动传感器的特点并比较其常用的测量电路的特点。 2. 试绘出图 5-7 所示的 ZI-A 型振动传感器的结构图,并分析其结构类型
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一、单项选择题(本大题共 15 小题,每小题 1 分,共 15 分) 在每小题列出的四个备选项中只有一个是符合题目要求的,请将其代码填写在题后的 括号内。错选、多选或未选均无分。 1.要提高放大电路的负载能力,可引入( ) A.串联负反馈 B.电压负反馈 C.并联负反馈 D.电流负反馈
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Applications of Inverters Conversion of electric power from DC type energy sources to AC type load -Battery Photovoltaic cell (Solar cell) Fuel cell +As a part of composite converter AC-DC-AC frequency converter(for AC motor drive) AC-DC-AC constant-voltage constant-frequency converter(for uninterruptable power supplies)
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一、单项选择题(在每小题的四个备选答案中,选出一个正确答案,并将正确答案的序号填在题干的括号内。每小题2分,共30分) 1.由理想二极管构成的限幅电路如下图所示当输入电压Ui=9V时,输出电压Uo为多少?() A.3V B.6V C.9V D.15V
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3.1 Basic DC to DC converters 3.1.1 Buck converter(Step-down converter) 3.1.2 Boost converter(Step-up converter) 3.1.3 Buck-Boost converter(Step-downstep-up converter)and Cuk converter 3.1.4 Sepic converter and Zeta converter 3.2 Composite DC/DC converters and connection of multiple DC/DC converters 3.2.1 A current-reversible chopper 3.2.2 Bridge chopper (H-bridge DC/DC converter) 3.2.3 Multi-phase multi-channel DC/DC converters
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⒈ 定义 第10章 数模转换和模数转 换电路 ⑴ 数模转换 将数字信号转换为相应的模拟信号称为数模转换或D/A转换或DAC(Digital to Analog Conversion)
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Schottky Power Rectifier employing the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features oN Semiconductor epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or http:/lonsemi.com
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一、例题精解 【例题6.1】图6.1(a)所示电路中,已知R=R1=R2=R3=22,C=1F,L=1H,E=12V。电路原来处于稳定状态,t=0时闭合开关S.试求初始值i(0+)ic(0+)、u(0+)
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he World's Largest-Capacity 8kV/3.6kA Light-Triggered Thyristor by Katsumi sato* Mitsubishi Electric has developed an 8kV/3.6kA light-triggered thyristor (LTT) based on a six inch wafer for power-converter applications in igh-voltage DC transmission and back-to-back systems. New design features give the device
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The IPMTS.OAT1/T3 Series is designed to protect voltage sensitive components from high voltage, high energy transients http:/lonsemi.com Excellent clamping capability, high surge capability, low zener impedance and fast response time. The advanced packaging technique provides for a highly efficient micro miniature, space PLASTIC SURFACE MOUNT saving surface mount with its unique heat sink design. The
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