MBRs320013 Surface mount ON Schottky Power Rectifier employing the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features oN Semiconductor epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or http:/lonsemi.com as free wheeling and polarity protection diodes in surface mount pplications where compact size and weight are critical to the system SCHOTTKY BARRIER Small Compact Surface Mountable Package with J-Bend Leads RECTIFIER Rectangular package for automated handling 3.0 AMPERE Highly Stable Oxide Passivated Junction 200 VOLTS Very High Blocking Voltage-200V ·150° COperating Junction Temperature Guardring for Stress Protection Mechanical Characteristics Case: Epoxy, Molded, Epoxy Meets UL94, vO Weight: 95 mg(approximately) e Finish: All External Surfaces Corrosion Resistant and termina Leads are Readily Solderable CASE 403A Lead and Mounting Surface Temperature for Soldering Purposes PLASTIC 260%C Max for 10 Seconds Shipped in 12 mm Tape and reel, 2500 units per reel Cathode polarity Band MARKING DIAGRAM Device Meets MsL 1 Requirements e ESD Ratings: Machine Model= A Human Body Model= IC B320= Device Code e Pb-Free Package is available MAXIMUM RATINGS Rating Symbol Value Unit ORDERING INFORMATION Device Package Shipping Working Peak Reverse Voltage DC Blocking Voltage MBRS3200T3 Average Rectified Forward Current A MBRS3200T3G SMB 2500/ Tape Reel L=120°) (Pb-Free Non-Repetitive Peak Surge Current tions Halfwave, Single Phase, 60 Hz) refer to our Tape and Reel Packaging Specification rochure. BRD8011/D Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the devic individual stress limit values(not ormal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. on Order Number 2004-Rev.2 MBRS3200T3/D
Semiconductor Components Industries, LLC, 2004 April, 2004 − Rev. 2 1 Publication Order Number: MBRS3200T3/D MBRS3200T3 Surface Mount Schottky Power Rectifier . . . employing the Schottky Barrier principle in a large area metal−to−silicon power diode. State−of−the−art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. • Small Compact Surface Mountable Package with J−Bend Leads • Rectangular Package for Automated Handling • Highly Stable Oxide Passivated Junction • Very High Blocking Voltage − 200 V • 150°C Operating Junction Temperature • Guardring for Stress Protection Mechanical Characteristics • Case: Epoxy, Molded, Epoxy Meets UL94, VO • Weight: 95 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped in 12 mm Tape and Reel, 2500 units per reel • Cathode Polarity Band • Device Meets MSL 1 Requirements • ESD Ratings: Machine Model = A ESD Ratings: Human Body Model = 1C • Marking: B320 • Pb−Free Package is Available MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (TL = 120 °C) IF(AV) 3.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 100 A Operating Junction Temperature TJ −65 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Device Package Shipping† ORDERING INFORMATION SMB CASE 403A PLASTIC MBRS3200T3 SMB 2500/Tape & Reel SCHOTTKY BARRIER RECTIFIER 3.0 AMPERE 200 VOLTS MARKING DIAGRAM B320 B320 = Device Code http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. MBRS3200T3G SMB (Pb−Free) 2500/Tape & Reel
MBRS3200T3 THERMAL CHARACTERISTICS Characteristic alue Unit 62 ELECTRICAL CHARACTERISTICS (lF=30ATJ=25°C lF=40A.TJ=25°C) (F=3.0A, T 50 Rated dc Voltage, TJ=150C 50 2. 1 inch square pad size(1 x 0.5 inch) for each lead on FR4 board 3. Pulse Test: Pulse Width= 300 us, Duty Cycle s2.0% httpllonsemi.com
MBRS3200T3 http://onsemi.com 2 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2) RJL RJA 13 62 °C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 3) (IF = 3.0 A, TJ = 25°C) (IF = 4.0 A, TJ = 25°C) (IF = 3.0 A, TJ = 150°C) VF 0.84 0.86 0.59 V Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 150°C) IR 5.0 5.0 A mA 1. Minimum pad size (0.108 × 0.085 inch) for each lead on FR4 board 2. 1 inch square pad size (1 × 0.5 inch) for each lead on FR4 board 3. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%.
MBRS3200T3 Eu Tc=150°c Tc=25° Suo Tc=150°c 0.1 0.20.3040.50.60.70.80.9 11.2 VE, INSTANTANEOUS VOLTAGE (VOLTS) VE, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward voltage 10E-03 1000 Tc=150° 10E-04 f= 1 MHz 210E0t=10℃ atv=209 V 10E-06 100 G10E-07 uOzd=9aoo 1.0E-08Tr=25c 10E-09L 10 020406080100120140160180200020406080100120140160180200 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLT Figure 3. Typical Reverse Current Figure 4. Typical Capacitance 5 SQUARE WAV O SQUARE WAVE z900 uou a0.5 TL, LEAD TEMPERATURE(C) lo, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating-Lead Figure 6. Forward Power Dissipation httpllonsemi.com
MBRS3200T3 http://onsemi.com 3 100 1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 10 0.8 0.9 1.1 1.2 IF, FORWARD CURRENT (AMPS) TC = 150°C TC = 25°C TC = 100°C 100 1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 1 VF, INSTANTANEOUS VOLTAGE (VOLTS) 10 0.8 0.9 1.1 1.2 IF, FORWARD CURRENT (AMPS) TC = 25°C TC = 150°C TC = 100°C 1.0E−09 0 20 40 60 80 100 160 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Typical Capacitance 120 140 180 200 IR, REVERSE CURRENT (AMPS) TC = 25°C TC = 150°C TC = 100°C 1000 10 0 20 40 60 80 100 160 VR, REVERSE VOLTAGE (VOLTS) 100 120 140 180 200 C, CAPACITANCE (pF) TC = 25°C f = 1 MHz 1.0E−08 1.0E−07 1.0E−06 1.0E−05 1.0E−04 1.0E−03 Typical Capacitance at 0 V = 209 V 0 80 90 100 110 120 150 TL, LEAD TEMPERATURE (°C) Figure 5. Current Derating − Lead Figure 6. Forward Power Dissipation 130 140 160 IF, AVERAGE FORWARD CURRENT (AMPS) 5 0 0123 4 IO, AVERAGE FORWARD CURRENT (AMPS) 2.5 P 5 6 fo, AVERAGE POWER DISSIPATION (W) 1 2 3 4 6 7 5 SQUARE WAVE dc 0.5 1 1.5 2 4.5 3 3.5 4 SQUARE WAVE dc
MBRS3200T3 CKAGE DIMENSIONS SMB PLASTIC PACKAGE CASE 403A-03 ISSUE D MEN SIONING AND TOLERANCING PER ANSI D DIMEN SION SHALL BE MEASUR ED WITHIN DIMENSION SOLDERING FOOTPRINT 0.089 2.743 0.085 SCALE 8: For additional information on our pb-fre egy and soldering details, please download the ON Semi Manual, solDE Soldering and re registered trademark Components Industries, LLC (SCILLC). SCILLC I fypical parameters which may be provided in SCiLLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All ded for surgical implant into the body, or manufacture of the part. SCILLC is an Equal Opportunity Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT. N.AmericanTechnicalSupport800-282-9855TollFreeOnSemiconductorWebsitehttp:/onsemi.com nada Japan: ON Semiconductor, Japan Customer Focus Center Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canad 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 For additional inf on, please contact you Phone:81-3-5773-3850 local Sales Representative. ABRS3200T3/D
MBRS3200T3 http://onsemi.com 4 PACKAGE DIMENSIONS SMB PLASTIC PACKAGE CASE 403A−03 ISSUE D A S D B J K P C H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM MIN MAX MIN MAX INCHES MILLIMETERS A 0.160 0.180 4.06 4.57 B 0.130 0.150 3.30 3.81 C 0.075 0.095 1.90 2.41 D 0.077 0.083 1.96 2.11 H 0.0020 0.0060 0.051 0.152 J 0.006 0.012 0.15 0.30 K 0.030 0.050 0.76 1.27 P 0.020 REF 0.51 REF S 0.205 0.220 5.21 5.59 mm inches SCALE 8:1 2.743 0.108 2.159 0.085 2.261 0.089 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 MBRS3200T3/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.