河源职业技术学院标准中国电子元件相关GB标准100条.pdf_大学文库

电子爱好者网站收集 www.eTuni.com 第 2 页共 7 页 15 GB/T 3389.4-1982 压电陶瓷材料性能测试方法柱体纵向长度伸缩振动模式 Test methods for the properties of piezoelectric ceramics--Longitudinal length extension vibration mode for rod 16 GB/T 3389.7-1986 压电陶瓷材料性能测试方法强场介电性能的测试 Test methods for the properties of piezoelectric ceramics--Test for dielectric properties in high electric field 17 GB/T 3389.8-1986 压电陶瓷材料性能测试方法热释电系数的测试 Test methods for the properties of piezoelectric ceramics--Test for the pyroelectric coefficient 18 GB/T 3664-1986 电容器非线性测量方法 Method of measurement of non-linearity in capacitors 19 GB/T 3788-1995 真空电容器通用技术条件 General specification for vacuum capacitors 20 GB/T 4071-1983 光致荧光粉测试方法 Measuring method for the phosphor excited by light 21 GB/T 4072-1983 阴极射线致荧光粉测试方法 Measuring method of the phosphor excited by cathode rays 22 GB/T 4098.1-1983 射频电缆电晕试验方法 Test method of corona for radio-frequency cables 23 GB/T 4098.2-1983 射频电缆电容和电容不平衡测量方法 Methods of measurement of capacitance and capacitance unbalance for radio-frequency cables 24 GB/T 4098.3-1983 射频电缆特性阻抗测量方法 Methods of measurement of characteristic impedance for radio-frequency cables 25 GB/T 4098.4-1983 射频电缆衰减常数测量方法 Methods of measurement of attenuation constant for radio-frequency cables 26 GB/T 4098.5-1983 射频电缆电容稳定性试验方法 Test method of capacitance stability for radio-frequency cables 27 GB/T 4098.6-1983 射频电缆衰减稳定性试验方法 Test method of attenuation stability for radio-frequency cables 28 GB/T 4098.7-1983 射频电缆高温试验方法 Test method of high-temperature for radiofrequency cables 29 GB/T 4098.8-1983 射频电缆低温试验方法 Test method of low-temperature for radiofrequency cables

电子爱好者网站收集 www.eTuni.com 第 3 页共 7 页 30 GB/T 4098.9-1983 射频电缆流动性试验方法 Test method of flow for radio-frequency cables 31 GB/T 4098.10-1983 射频电缆尺寸稳定性试验方法 Test method of dimensional stability for radio-frequency cables 32 GB/T 4165-1984 电子设备用可变电容器的使用导则 Guide to the use of variable capacitors in electronic equipment 33 GB/T 4166-1984 电子设备用可变电容器的试验方法 Methods of test of variable capacitors in electronic equipment 34 GB/T 4210-1984 电子设备用机电元件名词术语 Terms of electromechanical components for electronic equipment 35 GB/T 4475-1995 敏感元器件术语 Terms of sensor 36 GB/T 4588.1-1996 无金属化孔单双面印制板分规范 Sectional specification: single and double sided printed boards with plain holes 37 GB/T 4588.2-1996 有金属化孔单双面印制板分规范 Sectional specification: single and double sided printed boards with plated-through holes 38 GB/T 4588.3-1988 印制电路板设计和使用 Design and use of printed boards 39 GB/T 4588.4-1996 多层印制板分规范 Sectional specification--Multilayer printed boards 40 GB/T 4588.10-1995 印制板第 10 部分: 有贯穿连接的刚挠双面印制板规范 Printed boards--Part 10: Specification for flex-rigid double-sided printed boards with through connections 41 GB/T 4596-1984 电子设备用三相变压器形铁心 E-cores for three-phase transformers for use in electronic equipment 42 GB/T 4677.1-1984 印制板表层绝缘电阻测试方法 Test method of surface insulation resistance for printed boards 43 GB/T 4677.2-1984 印制板金属化孔镀层厚度测试方法微电阻法 Micro-resistance test method of plating thickness of platedthrough holes for printed boards 44 GB/T 4677.3-1984 印制板拉脱强度测试方法 Test methods of pull strength for printed boards 45 GB/T 4677.4-1984 印制板抗剥强度测试方法 Test methods of peel strength for printed boards

电子置好者网储收焦mTni.c3m 46GB/T4677.5-1984印制板摄曲度测试方法Test methods of platness for primted board 47GBT46刀.6-1984金属和氧化厦盖层厚度测试方法截面金相法Test methods for thickness of metal and oxide coating by microscopical examination of cross-section 48GB/T4677.7-1984印制板镀层附着力试验方法胶替法Test method of pla城ting adhesion by adhesive type for printed boards 49GB/T4677&-1984印制板赞涂覆层厚度测试方法B反向散射法Test method0 (plating and coating thickness by beta backseatering for printed boards 50GB/T4677.9l984印制板镀层孔限率电图象测试方法The electrographic te城method of plating porosity for printed boards 51GBw/T4677.10-1984印制板可挥性测试方法Test method of soldera南ility for printed bo 52GBT4677.Il-l9g4印制板附热冲击试枪方法Test methods of thermal shock for printed boards 53GB/T4677.12.1988印制板互连电I测试方法Test method of interconnection resistance fo printed boards S4GB/T467刀.1多-1988印制板金属化孔电阻的变化热循环测试方法Te时ethod of change in resistance of plated-through holes--Thermal cycling for printed boards 55GB/T467.1+-1988印制板蒸汽-氧气加速老化试验方法Test method of steam/oxygen accelerated ageing of printed board S6GB/T4677.15-1988印制板绝锋涂层耐溶剂和耐厚剂试巢方法Test method for solvent and flux resistance of insulating coating on printed boards 57GB/T4677.16-1988印制板一般检验方法General ecamination method for printed boar也 58GB/T4677.17.1988多层印制板内层绝缘电阻测试方法Test method for insulation resistance within inner layers of multilayer primed boards 59GBT4677.18-1988多层印制板层间绝缘电阻测试方法Test method for insulation resistance between layers of multilayer printed boards 60GB/T467.I9-I988印制板电路完香性测试方法Test method for electrical imegrity of printed boards 61GB/T467720-I988印制板镀层附着性试验方法摩擦法Test method for plating adhesion of printed boards-Bumishing 第4夏共7页

电子爱好者网站收集 www.eTuni.com 第 4 页共 7 页 46 GB/T 4677.5-1984 印制板翘曲度测试方法 Test methods of platness for printed boards 47 GB/T 4677.6-1984 金属和氧化覆盖层厚度测试方法截面金相法 Test methods for thickness of metal and oxide coating by microscopical examination of cross-section 48 GB/T 4677.7-1984 印制板镀层附着力试验方法胶带法 Test method of plating adhesion by adhesive type for printed boards 49 GB/T 4677.8-1984 印制板镀涂覆层厚度测试方法 β反向散射法 Test method of plating and coating thickness by beta backscattering for printed boards 50 GB/T 4677.9-1984 印制板镀层孔隙率电图象测试方法 The electrographic test method of plating porosity for printed boards 51 GB/T 4677.10-1984 印制板可焊性测试方法 Test method of solderability for printed boards 52 GB/T 4677.11-1984 印制板耐热冲击试验方法 Test methods of thermal shock for printed boards 53 GB/T 4677.12-1988 印制板互连电阻测试方法 Test method of interconnection resistance for printed boards 54 GB/T 4677.13-1988 印制板金属化孔电阻的变化热循环测试方法 Test method of change in resistance of plated-through holes--Thermal cycling for printed boards 55 GB/T 4677.14-1988 印制板蒸汽-氧气加速老化试验方法 Test method of steam/oxygen accelerated ageing of printed board 56 GB/T 4677.15-1988 印制板绝缘涂层耐溶剂和耐焊剂试验方法 Test method for solvent and flux resistance of insulating coating on printed boards 57 GB/T 4677.16-1988 印制板一般检验方法 General examination method for printed boards 58 GB/T 4677.17-1988 多层印制板内层绝缘电阻测试方法 Test method for insulation resistance within inner layers of multilayer printed boards 59 GB/T 4677.18-1988 多层印制板层间绝缘电阻测试方法 Test method for insulation resistance between layers of multilayer printed boards 60 GB/T 4677.19-1988 印制板电路完善性测试方法 Test method for electrical integrity of printed boards 61 GB/T 4677.20-1988 印制板镀层附着性试验方法摩擦法 Test method for plating adhesion of printed boards— Burnishing

电子爱好者网站收集 www.eTuni.com 第 5 页共 7 页 62 GB/T 4677.21-1988 印制板镀层孔隙率测试方法气体暴露法 Test method for plating porosity of printed boards--The gas exposure method 63 GB/T 4677.22-1988 印制板表面离子污染测试方法 Test method for surface ionic contamination of printed boards 64 GB/T 4677.23-1988 印制板阻燃性能测试方法 Test method for flammability of printed boards 65 GB/T 4721-1992 印制电路用覆铜箔层压板通用规则 General rules for copper-clad laminated sheets for printed circuits 66 GB/T 4722-1992 印制电路用覆铜箔层压板试验方法 Test methods for copper-clad laminated sheets for printed circuits 67 GB/T 4723-1992 印制电路用覆铜箔酚醛纸层压板 Phenolic cellulose paper copper-clad laminated sheets for printed circuits 68 GB/T 4724-1992 印制电路用覆铜箔环氧纸层压板 Epoxide cellulose paper copper-clad laminated sheets for printed circuits 69 GB/T 4725-1992 印制电路用覆铜箔环氧玻璃布层压板 Epoxide woven glass fabric copperclad laminated sheets for printed circuits 70 GB/T 4779.1-1984 彩色显象管用荧光粉 Y22-G3 荧光粉 Phosphors for color picture tubes use--Phosphor Y22-G3 71 GB/T 4779.2-1984 彩色显象管用荧光粉 Y22-B2 荧光粉 Phosphors for color picture tubes use--Phosphor Y22-B2 72 GB/T 4779.3-1984 彩色显象管用荧光粉 Y22-R4 荧光粉 Phosphors for color picture tubes use--Phosphor Y22-R4 73 GB/T 4825.1-1984 印制板导线局部放电测试方法 Test method for partial discharge of conductors on printed boards 74 GB/T 4825.2-1984 印制板导线载流量测试方法 Test method for current carrying capacity of conductors on printed boards 75 GB/T 4874-1985 直流固定金属化纸介电容器总规范 Generic specification for fixed metallized paper dielectric capacitors for direct current 76 GB/T 5076-1985 具有两个轴向引出端的圆柱体元件的尺寸测量 Measurement of the dimensions of a cylindrical component having two axial terminations

电子爱好者网姑收旗nl.0通 77GB/T5077.l985电容器和电阻器的最大外形尺寸Maximum case dimerssions for capacitors and resistors 78GBT5078-1985单向引出的电容器和电阻器所需空间的测定方法Method f每e determination of the space required by capacitors and resistors with unidirectional temminations 79GB/T5489-1985印制板制图Primted board drawing 80GBT5594.1-1985电子元器作结构陶瓷材料性腹测试方法气密性测试方法T过 methods for properties of structure ceramic used in electronic components-Test method for gas tightness 81GB/T55942.1985电子元器件结构陶瓷材料性能测试方法杨氏弹性模量、泊松比测试 Test methods for properties of structure ceramic used in electronic components--Test method for Youngs elastic modulus and Poisson ratio 82GBT5594子1985电子元器件结构陶瓷材料性能测试方法平均线膨张系数测试方法 Test methods for properties of structure ceramie ued in electronic components-Test method for mean coefficient of linear expansion 83GB/T5594.41985电子元器件结构陶瓷材料性陵测试方法介质损耗角正切值的测试方 Test methods for properties of structure ceramic used in electronie components--Test method for diclectric loss angle tangent value 8:GB/T5594.5-19然5电子元器件结构刚登材料性能测试方法体积电阻率测试方法T似 methods for properties of structure ceramic used in electronic components-.Test method for volume resistivity 85GB/T5594.6l985电子元器件结构陶瓷材料性能测试方法化学稳定性测试方法T过 methods for properties of structure ceramic used in electronic compooents-Test method for chemical durability 8新GBT5594.7-1985电子元器作结构测瓷材料性能测试方法透液性测定方法T methods for properties of structure ceramie used in electronic components-Test method for liquid permeability 87GB/T5594&1985电子元器作结构陶瓷材料性能测试方法显微结构的测定T似 methods for properties of structure ceramic ued in electronic components-Determination of microstructure 88GB/T5598l9g5氧化鼓瓷导热系数测定方法Test method for thermal conductivity of berylliumm ooide ceramics 第6页共7页

电子爱好者网站收集 www.eTuni.com 第 6 页共 7 页 77 GB/T 5077-1985 电容器和电阻器的最大外形尺寸 Maximum case dimensions for capacitors and resistors 78 GB/T 5078-1985 单向引出的电容器和电阻器所需空间的测定方法 Method for the determination of the space required by capacitors and resistors with unidirectional terminations 79 GB/T 5489-1985 印制板制图 Printed board drawing 80 GB/T 5594.1-1985 电子元器件结构陶瓷材料性能测试方法气密性测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for gastightness 81 GB/T 5594.2-1985 电子元器件结构陶瓷材料性能测试方法杨氏弹性模量、泊松比测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for Youngs elastic modulus and Poisson ratio 82 GB/T 5594.3-1985 电子元器件结构陶瓷材料性能测试方法平均线膨胀系数测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for mean coefficient of linear expansion 83 GB/T 5594.4-1985 电子元器件结构陶瓷材料性能测试方法介质损耗角正切值的测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for dielectric loss angle tangent value 84 GB/T 5594.5-1985 电子元器件结构陶瓷材料性能测试方法体积电阻率测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for volume resistivity 85 GB/T 5594.6-1985 电子元器件结构陶瓷材料性能测试方法化学稳定性测试方法 Test methods for properties of structure ceramic used in electronic components--Test method for chemical durability 86 GB/T 5594.7-1985 电子元器件结构陶瓷材料性能测试方法透液性测定方法 Test methods for properties of structure ceramic used in electronic components--Test method for liquid permeability 87 GB/T 5594.8-1985 电子元器件结构陶瓷材料性能测试方法显微结构的测定 Test methods for properties of structure ceramic used in electronic components--Determination of microstructure 88 GB/T 5598-1985 氧化铍瓷导热系数测定方法 Test method for thermal conductivity of beryllium oxide ceramics

电子置好者网储收焦mTni.c3m 9GB/T5729-194电子设备用固定电阻器第一部分：总规范Fixed resis05 for use im clectronic equipment-Part 1:Generic specification 90GB/T5730-1985电子设备用固定电阻器第二部分：分规范：低功率非线绕四定电阻器 (可供认证用)Fixed resistors for use in electronic equipment.-Part2:Sectional specification Fived low-power non-wire wound resistors 91GBT5311985电子设备用固定电阻器第二部分：空白详细规范：低功率非线绕固定电阻器汗定水平E(可供认证用)Fixed resistors for use in electronie equipment--Part2 Blank detail specification:Fixed low-power non-wire wound resistors-Assessment level E 92GBT5721985电子设备用固定电阻器第四部分：分规范：功率型固定电阳器可供认 Fixed resistors for use in electronie equipment--Part 4:Sectional specification:Frved power resistors 93GBT5733-1985电子设备用固定电阻器第四部分：空白详细规范：功率型固定电阻器评定水平E(可供认i证用Fixed resistors for use in electronic equipment-Pat4 Blank detail specification:Fixed power resistors Assessment level E 94GB/T57341985电子设备用国定电阻器第五分：分规范：精密固定电阻器（可供认证 Fixed resistors for use in electronic equipment--Part 5:Sectional specification:Fixed precision resistors 95GB/T5735-19然5电子设备用四定电阻墨第五部分：空白细规范：精密固定电阻器评定水平E(可供认证用)Fixed resistors for use in electronic equipment-Pats:Blank detail specification:Fixed precision resistors-Assessment level E 96GB/T583移.198M6萸光粉名词术语Terms for phosphors 97GB/T5966199%电子设备用固定电容器第8部分：分规范：1类觉介固定电容器Fd capacitors for use in electronic equipment--Part 8:Sectional specification:Fixed capacitors of ceramic dielectric,class I 98GBT5967.199%电千发备用因定电容器第8富分空自详国规范1类瓷介固定电容器评定水平E Fixed capacitors for use in electronic equipment-Pt8:Blank detail specification Fixed capacitors of ceramic dielectric,class 1--Assessment level E 99GBT59%8-1996电子设备用固定电容器第9部分：分规范2类登介固定电容器Fd capacitors for use in clectronic equipment--Part 9.Sectional specification Fixed capacitors of ceramic dielectric,class 2 100GBT5969.1996电子设备用固定电容器第9部分：空白详细规范2类瓷介电容器评 E Fixed capacitors for use in electronic equipment--Part 9 Blank detail specification Frved capacitor of ceramic dielectric,class 2-Assessment level E 第7算共7页

电子爱好者网站收集 www.eTuni.com 第 7 页共 7 页 89 GB/T 5729-1994 电子设备用固定电阻器第一部分: 总规范 Fixed resistors for use in electronic equipment--Part 1: Generic specification 90 GB/T 5730-1985 电子设备用固定电阻器第二部分: 分规范: 低功率非线绕固定电阻器 (可供认证用) Fixed resistors for use in electronic equipment--Part 2: Sectional specification: Fixed low-power non-wire wound resistors 91 GB/T 5731-1985 电子设备用固定电阻器第二部分: 空白详细规范: 低功率非线绕固定电阻器评定水平 E (可供认证用) Fixed resistors for use in electronic equipment--Part 2: Blank detail specification: Fixed low-power non-wire wound resistors--Assessment level E 92 GB/T 5732-1985 电子设备用固定电阻器第四部分: 分规范: 功率型固定电阻器(可供认证用) Fixed resistors for use in electronic equipment--Part 4: Sectional specification: Fixed power resistors 93 GB/T 5733-1985 电子设备用固定电阻器第四部分: 空白详细规范: 功率型固定电阻器评定水平 E (可供认证用) Fixed resistors for use in electronic equipment--Part 4: Blank detail specification: Fixed power resistors Assessment level E 94 GB/T 5734-1985 电子设备用固定电阻器第五部分: 分规范: 精密固定电阻器 (可供认证用) Fixed resistors for use in electronic equipment--Part 5: Sectional specification: Fixed precision resistors 95 GB/T 5735-1985 电子设备用固定电阻器第五部分: 空白详细规范: 精密固定电阻器评定水平 E (可供认证用) Fixed resistors for use in electronic equipment--Part 5: Blank detail specification: Fixed precision resistors--Assessment level E 96 GB/T 5838-1986 荧光粉名词术语 Terms for phosphors 97 GB/T 5966-1996 电子设备用固定电容器第 8 部分: 分规范: 1 类瓷介固定电容器 Fixed capacitors for use in electronic equipment--Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, class 1 98 GB/T 5967-1996 电子设备用固定电容器第 8 部分: 空白详细规范 1 类瓷介固定电容器评定水平 E Fixed capacitors for use in electronic equipment--Part 8: Blank detail specification Fixed capacitors of ceramic dielectric, class 1--Assessment level E 99 GB/T 5968-1996 电子设备用固定电容器第 9 部分: 分规范 2 类瓷介固定电容器 Fixed capacitors for use in electronic equipment--Part 9: Sectional specification Fixed capacitors of ceramic dielectric, class 2 100 GB/T 5969-1996 电子设备用固定电容器第 9 部分: 空白详细规范 2 类瓷介电容器评定水平 E Fixed capacitors for use in electronic equipment--Part 9: Blank detail specification Fixed capacitor of ceramic dielectric, class 2 --Assessment level E

河源职业技术学院 标准 中国电子元件相关GB标准100条

河源职业技术学院标准中国电子元件相关GB标准100条