85.1 Digital IC Testing Taxonomy of Testing • Fault Models • Test Pattern Generation • Output Response Analysis 85.2 Design for Test The Testability Problem • Design for Testability • Future for Design

通过本章的学习，将能够： 1. 画出典型的亚微米 CMOS IC 制造流程图； 2. 描述 CMOS 制造工艺14个步骤的主要目的； 4. 讨论每一步 CMOS 制造流程的关键工艺

Contents of Electronics Chapter 1 Introduction Chapter 2 Operational Amplifiers Chapter 3 Diodes and Diode Circuits Chapter 4 Bipolar Junction Transistors Chapter 5 Field-Effect Transistors Chapter 6 Digital Logic Circuits Chapter 7 Differential and Multistage IC Chapter 8 Frequency Response Chapter 9 Feedback and Oscillators Chapter 10 Output Stages and Power Chapter 11 Active Filters and Tuned Circuits

一、例题精解 【例题6.1】图6.1(a)所示电路中,已知R=R1=R2=R3=22,C=1F,L=1H, E=12V。电路原来处于稳定状态,t=0时闭合开关S.试求初始值i(0+)ic(0+)、u(0+)、 uc(0) R

1 The switch in Fig.5-27 is opened at=0, Find i (0*) and v (0*) 1kΩ D100v 1k2 Fig. 5-27 For prob.1. The switch is closed at= 0 in Fig.5-28. Find i(*) and ic(0*) if the capacitor is initially

TWO-Terminal Ic DEVICES Temperature Transducer AD590 FEATURES PIN DESIGNATIONS Linear Current Output: 1 HA/K Wide Range:-55C to+150C Probe Compatible Ceramic Sensor Package

1.下列电池中,哪个电池的电动势与Cl-离子的活度无关 (A) Zn ZnC12(ag) IC12(8) (B) Zn ZnC12() IKC1 (ag) AgC1(s) Ag (C) Ag I AgC1(s) KC1 (ag)(g)IPt

Microelectronics Processing technology Fall Term 2003 Instructions for the microfluidics Lab report Your lab report should follow the format of the IEEE Electron Device Letters. The format from the IC and mEMs Lab reports will be used Contents: Your Letter should include the following sections y-line(Author, affiliation, and submission date)

Microelectronics Processing technology Fall Term 2003 Instructions for the mems Lab report Your lab report should follow the format of the IEEE Electron Device Letters. The format from the IC Lab report will be used Contents: Your Letter should include the following sections

Rellablllty of semiconductor I CS plus spin-based electronics 6. 12J/3.155J Microelectronic processing Read Campbell, p. 425-428 and Ch. 20 Sec. 20.1, 20.2: Plummer, Sec. 11.5.6 IC reliability: Yield=( operating parts)/(total# produced) Particles on surface interrupt depositions, flaw devices