5.1 IGZO金属氧化物半导体的物理基础 5.1.1 IGZO的结构与能带 5.1.2 a-IGZO中的电子态 5.1.3 CAAC-IGZO中的电子态 5.1.4 IGZO中的载流子传输机制 5.2 IGZO-TFT的工作原理与特性 5.3 金属氧化物 TFT 中的关键材料 5.4 金属氧化物半导体薄膜的制备工艺 5.4.1 磁控溅射法 5.4.2 溶液法 5.5 金属氧化物TFT 结构、制造工艺与性能 5.6 金属氧化物TFT的稳定性

 概述  串行通信的实现  串行通信的基本术语  可编程串行通讯接口芯片8251A简介  串行通信RS－232C  USB总线简介

厚壁菌门，柔膜菌门和放线菌 18.1 Nonsporulating Firmicutes 18.2 Endospore-Forming Firmicutes 18.3 Mollicutes: The Mycoplasmas 18.4 Actinobacteria: Coryneform and Propionic Acid Bacteria 18.5 Actinobacteria: Mycobacterium 18.6 Filamentous Actinobacteria: Streptomyces and Relatives 18.7 Cyanobacteria 蓝细菌 18.8 Prochlorophytes 原绿生物 18.9 The Chlamydia 衣原体 The Planctomycetes 浮霉菌门 18.10 Planctomyces: A Phylogenetically Unique Bacterium 疣微菌门 18.11 Verrucomicrobium and Prosthecobacter疣微菌属和突柄杆菌属 18.12 Bacteroides and Flavobacterium 18.13 Acidobacteria 酸杆菌 The Cytophaga Group 噬纤维菌 18.14 Cytophaga and Relatives 18.15 Chlorobium and Other Green Sulfur Bacteria 绿硫杆菌属等绿色硫细菌 18.16 Spirochetes螺旋体 18.17 Deinococcus and Thermus Hyperthermophilic Bacteria 18.19 Thermotoga and Thermodesulfobacterium 18.20 Aquifex, Thermocrinis, and Relatives Chen Feng, Microbiology, SJTU 18.20 Aquifex, Thermocrinis, and Relatives 18.21 Nitrospira and Deferribacter

 2.1 What is a Financial System?  2.2 The Flow of Funds  2.3 The Functional Perspective  2.4 Financial Innovation & the “Invisible Hand”  2.5 Financial Markets  2.6 Financial Market Rates  2.7 Financial Intermediaries  2.8 Financial Infrastructure and Regulation  2.9 Governmental & Quasi- Governmental Organizations

10.1 What is Risk? 10.2 Risk and Economic Decisions 10.3 The Risk-Management Process 10.4 The Three Dimensions of Risk Transfer 10.5 Risk Transfer and Economic Efficiency 10.6 Institutions for Risk Management 10.7 Portfolio Theory: Quantitative Analysis for Optimal Risk Management 10.8 Probability Distributions of Returns 10.9 Standard Deviation as a Measure of Risk

7.1 环境噪声基础 7.1.1声音的产生和基本概念 7.1.2环境噪声 7.1.3环境噪声评价量及其计算 7.2 噪声的测量 7.2.1噪声测量仪器 7.2.2监测规范与布点原则 7.3 环境噪声预测模型 7.3.1声源声级A的确定 7.3.2噪声传播衰减计算 7.4噪声环境影响评价 7.4.1噪声评价工作程序和等级 7.4.2噪声环境影响报告内容

11.1 Using Forward & Futures Contracts to Hedge Risks 11.2 Hedging Foreign-Exchange Risk with Swap Contracts 11.3 Hedging Shortfall-Risk by Matching Assets to Liabilities 11.4 Minimizing the Cost of Hedging 11.5 Insuring versus Hedging 11.6 Basic Features of Insurance Contracts 11.7 Financial Guarantees 11.8 Caps & Floors on Interest Rates 11.9 Options as Insurance 11.10 The Diversification Principle 11.11 Insuring a Diversified Portfolio

14.1 Distinction Between Forward & Futures Contracts 14.2 The Economic Function of Futures Markets 14.3 The Role of Speculators 14.4 Relation Between Commodity Spot & Futures Prices 14.5 Extracting Information from Commodity Futures Prices 14.6 Forward-Spot Price Parity for Gold 14.7 Financial Futures 14.8 The “Implied” Riskless Rate 14.9 The Forward Price is not a Forecast of the Spot Price 14.10 Forward-Spot Price- Parity with Cash Payouts 14.11 “Implied” Dividends 14.12 The Foreign-Exchange Parity Relation 14.13 The Role of Expectations in Determining Exchange Rates

 3.1 Functions of Financial Statements  3.2 Review of Financial Statement  3.3 Market values v. Book Values  3.4 Accounting v. Economic Measures of Income  3.5 Return on Shareholders v. Return on Book Equity  3.6 Analysis Using Financial Ratios  3.7 The Financial Planning Process  3.8 Constructing a Financial Planning Model  3.9 Growth & the Need for External Financing  3.10 Working Capital Mgmt.  3.11 Liquidity & Cash Mgmt

This book is designed to help the engineer understand the principles of metal form￾ing and to analyze forming problems – both the mechanics of forming processes and how the properties of metals interact with the processes. In this book, an entire chapter is devoted to forming limit diagrams and various aspects of stamping and another to other sheet forming operations. Sheet testing is covered in a separate chapter. Coverage of sheet metal properties has been expanded. Interesting end￾of-chapter notes have been added throughout, as well as references. More than 200 end-of-chapter problems are also included