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Closed book Covers lecture materials covered in problem sets through lithography Five questions, 20 pts. each a formula sheet will be provided a Sample quizzes from previous terms and the formula sheet are on the course web site Spring 2003 -Prepared by C. ross
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We saw how dopants were introduced into a wafer by using diffusion (predepositionanddrive-in') This process is limited cannot exceed solid solubility of dopant -difficult to achieve light dopin Ion implantation is preferred because controlled, low or high dose can be
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Review of process Structures to be tested Sheet resistance MOS Capacitor Fall 2003-MA schmidt
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Why spend a whole lecture on oxidation of Si? Ge has high ue, Wh, Ge stable but no oxide GaAs has high ue and direct band Why sio? Sio, is stable down to 10 9 Torr. T>900C Sio can be etched with hf which leaves si unaffected
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What does Materials Science have to do with Microelectronic Processing? Need to understand DIfferences: metals, oxides and semiconductors Atomic bonding Oxidation rates
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What does Materials Science have to do with Microelectronic Processing? Need to understand DIfferences: metals, oxides and semiconductors Atomic bonding Oxidation rates, compound formation(GaAs)
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