How small would you like to go?...and can you go? with semiconductors?. with lithography 6.12J/3.155J Microelectronic processing Semiconductor scaling drivers: Speed of light in global interconnects, vac/vK Increased information density

CRYSTAL GROWTH step Crystal and questlons 1. Reactants In molten form 2. Transport to s/L Interface TAS Increases AH decreases

Outline Introductions Staff You Motivation Course organization Handout a Lab assignments Safety M.A. Schmidt

Rellablllty of semiconductor I CS plus spin-based electronics 6. 12J/3.155J Microelectronic processing Read Campbell, p. 425-428 and Ch. 20 Sec. 20.1, 20.2: Plummer, Sec. 11.5.6 IC reliability: Yield=( operating parts)/(total# produced) Particles on surface interrupt depositions, flaw devices

MEMS Mask layout Die leve Dark-field mask Dimensions are in micron

Evaporation and sputter deposition [15] 1. a)In the plasma of a sputter deposition system, consider an argon atom that is ionized during a collision in the plasma. i) Express the ratio of the acceleration of the liberated electron to that of the argon ion in terms of M and m, the mass of the ion and electron; give the numerical value of this ratio, and say in which

Some useful equations for Quiz# 2 Constants:kB=1.38×1023J/K=862×105eV/K,e=16×101Coul I atm=760 Torr=10 Pa Ideal gas: Pv=NkBT N/=n=C(concentration), J

Gas flux across concentration gradient: J=h(Cg-Cs ), Cs=concentration at surface Flux for chemical reaction: J(#/vol s)=k Cs, where k=koexp[-AG/(kBT)I Film growth velos/ hk ii where Nr is number of deposited species/cm Diffusio

Due Sept 17. 2002 1. a) Mean free path 2= kBI d-p where k=1.38×102,T=293K,p=10mTor=133Pa,d=1A=100m 38×10-3(293 6.9cm ford=1A Jr(m)(332)017mfrd=2A b) Use the ideal gas law pV=nkB T 1.33Pa vk7(138×102X90)33×10m-33×10cm3

All the questions are from Plummer, Chapter 10, p.679-680, which was handed out in class 1)Question 10.3 2) Question 10.4 3)Question 10.5 4) Question 10.6