Sputter deposition: Read Plummer Chap 9, Sections 9.2.2.2 to 9.3.10. Consider reading Ohring 1. You need to deposit a high quality (low electrical resistivity) Al film at a very high rate(v> I micron/min) and achieve good step coveage using sputter deposition

MEMS LAB SESSION 2 Undercut Silicon Nitride using KOH Etching OVERVIEW OF LAB SESSION: This lab session utilizes potassium hydroxide(koh) wet etching to undercut and release the silicon nitride cantilevers and fixed-fixed beams. In Step

In this lab session, the cantilever and fixed-fixed beams will be mechanically tested to determ material and device performance characteristics. The structures will be mechanically loaded the corresponding deflection measured. From the load versus deflection curves, an effective

Massachusetts Institute of Technology POLY GATE MOSCAP PROCESS SUMMARY Lab session 1 1. 1 Lab Safety and Cleanroom Orientation 1.2 RCA ( ICL RC 1.3 Gate Oxidation Thermco Atmospheric Furnace(5D-FieldOx

This lab session will utilize photolithography and dry etching to transfer a pattern from a mask to a substrate. In Step 1. 1, the thickness and the refractive index of the silicon nitride film are measured. In Step

The mosfet structure Semiconductor Doping The mosfet as a switch A MOSFET Process The mos capacitor Process Recommended reading Plummer, Chapter 1 Fall 2003-MA schmidt

Outline Introductions Staff You Motivation Course organization Handout a Lab assignments Safety M.A. Schmidt

We saw oⅴD Gas phase reactants: po l mTorr to l atm Good step coverage, T> 350 K We saw sputtering Noble (+ reactive gas)p 10 mTorr; ionized particles Industrial process high rate reasonable step coverage

Covers materials in lectures from 10/15 through 11/26 Does not include Lab Lectures A formula sheet will be provided (if needed) Lecture on Monday, Dec. 8th Lab tour of Analog Devices MEMS Facility We will leave from the classroom at 2: 35PM SHARP

lasma enhanced surface diffusion without need for Dry etching Momentum transfer from plasma to remove surface species e We will see evaporation: Evaporate