4.1 表象理论 4.1.1 菲克第一定律 4.1.2 菲克第二定律 4.1.3 扩散方程的解 4.1.4 置换固溶体中的扩散 4.2 扩散的热力学分析 4.2.1 扩散驱动力 4.2.2 上坡扩散影响因素 4.3 扩散的原子理论 4.3.1 扩散机制 4.3.2 原子跳跃和扩散系数 4.4 扩散激活能 4.5 无规行走与扩散距离 4.6 影响扩散的因素

9.1 烧结(Sintering) 9.1.1 烧结的驱动力(Driving force for sintering) 9.1.2 烧结过程(Sintering process) 9.1.3 颗粒的粘附作用(Interparticle adherence) 9.1.4 物质的传递(Transport phenomenon) 9.1.5 再结晶和晶粒长大(Recrystallization and grain growth) 9.2 聚合( Polymerization) 9.2.1逐步聚合(Step polymerization) 9.2.2连锁聚合 (Chain polymerization)

1.1 晶体学基础 1.1.1 空间点阵和晶胞 1.1.2 晶向指数和晶面指数 1.1.3 晶体的对称性 1.1.4 极射投影 1.2 金属的晶体结构 1.2.1 三种典型的金属晶体结构 1.2.2 晶体的原子堆垛方式和间隙 1.2.3 多晶型性

8.3.1 共晶转变机制 8.3.2 共晶组织形貌 8.3.3 亚共晶和过共晶合金初生相形态 8.3.4 共晶系合金的非平衡结晶 1伪共晶 2 离异共晶 3 固溶体合金中的共晶组织

8.2.1 固溶体合金的结晶特点 8.2.2 固溶体合金的平衡结晶 8.2.3 固溶体合金的非平衡结晶 8.2.4 固溶体非平衡结晶时溶质的再分配 8.2.5 成分过冷（Constituation supercooling）

8.1.1 液态结构 (Liquid-state structure) 8.1.2 结晶的热力学条件和过冷度 8.1.3 结晶过程 (Crystallization process) 8.1.4 均匀形核（Homogeneous nucleation） 8.1.5 非均匀形核（Heterogeneous nucleation） 8.1.6 晶体长大 (Crystal growth)

7.1 扩散的宏观规律—扩散定律（Diffusion laws） 7.1.1 菲克第一定律（Fick‘s first law） 7.1.2 菲克第二定律（Fick's second law） 7.2 扩散机制 (Diffusion mechanisms) 7.3 扩散系数 (Diffusion coefficient) 7.3.1扩散系数和原子跳动 7.3.2 扩散系数与扩散激活能 7.3.3 柯肯达尔效应(Kirkendall effect) 7.4 扩散驱动力 7.5 反应扩散 7.6 影响扩散的因素

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added

Describing the fundamental physical properties of materials used in electronics, the thorough coverage of this book will facilitate an understanding of the technological processes used in the fabrication of electronic and photonic devices. The book opens with an introduction to the basic applied physics of simple electronic states and energy levels. Silicon and copper, the building blocks for many electronic devices, are used as examples. Next, more advanced theories are developed to better account for the electronic and optical behavior of ordered materials, such as diamond, and disordered materials, such as amorphous silicon. Finally, the principal quasi-particles (phonons, polarons, excitons, plasmons, and polaritons) that are fundamental to explaining phenomena such as component aging (phonons) and optical performance in terms of yield (excitons) or communication speed (polarons) are discussed

绪论 实验课程简介 第一部分 实验一：金相制备 第一章 金相显微镜的介绍 1．金相显微镜的光学放大原理 2．金相显微镜的主要性能 3．金相显微镜的构造和使用 第二章 金相样品的制备 1 取样 2 镶嵌 3 磨制 4 抛光 5 浸蚀 第三章 硬度测试 布氏硬度试验 第四章 实验概述 1 实验目的 2 实验内容 3 实验所用设备及材料 4 实验步骤 第二部分 实验二：金相观察 第一章 铁碳合金的介绍 1 工业纯铁 2 碳钢 3 白口铸铁 第二章 材料的塑性变形及回复再结晶 1 原理概述 3 材料及设备 第三章 实验概述 第三部分 实验报告 1 预习报告 2 实验报告