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电子科技大学:《射频集成电路 RF Integrated Circuits》课程教学资源(课件讲稿)第二讲 CMOS器件

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Simplistic Model Physical Structure Threshold Voltage Long Channel Current Equations Regions of Operation Transconductance Channel Length Modulation CMOS Processing Technology MOS Layout Device Capacitances Device Capacitances Passive Devices Small Signal Models Circuit Impedance Equivalent Transconductance Short-Channel Effects Drain-Induced Barrier Lowering (DIBL) Effects of Velocity Saturation Hot Carrier Effects
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第二讲 CMOS器件 游飞博导,副教授 电子科学与工程学院,feiyou@uestc.edu.cn 22西/

2020/3/7 1 第二讲 CMOS器件 游飞 博导,副教授 电子科学与工程学院, feiyou@uestc.edu.cn

Transistor Transistor stands for .. Transistor are semiconductor devices that can be classified as -Bipolar Junction Transistors (BJTs) Field Effect Transistors(FETs) Depletion-Mode FETs or(e.g.,JFETs) Enhancement-Mode FETs(e.g.,MOSFETs) 西7

2020/3/7 2 SM 11 EECE 488 ± Set 1: Introduction and Background Transistor ‡ Transistor stands for « ‡ Transistor are semiconductor devices that can be classified as ± Bipolar Junction Transistors (BJTs) ± Field Effect Transistors (FETs) ‡ Depletion-Mode FETs or (e.g., JFETs) ‡ Enhancement-Mode FETs (e.g., MOSFETs)

Simplistic Model MOS transistors have three terminals:Gate,Source,and Drain Gate Souw,六an The voltage of the Gate terminal determines the type of connection between Source and Drain (Short or Open). Thus,MOS devices behave like a switch NMOS PMOS Ve high Device is ON Device is OFF D is shorted to S D S are disconnected Ve low Device is OFF Device is ON D &S are disconnected D is shorted to S 2西3/7

2020/3/7 3 SM 12 EECE 488 ± Set 1: Introduction and Background Simplistic Model ‡ MOS transistors have three terminals: Gate, Source, and Drain ‡ The voltage of the Gate terminal determines the type of connection between Source and Drain (Short or Open). ‡ Thus, MOS devices behave like a switch Device is ON D is shorted to S Device is OFF D & S are disconnected VG low Device is OFF D & S are disconnected Device is ON D is shorted to S VG high NMOS PMOS

Physical Structure 1 。 Source and Drain terminals are identical except that Source provides charge carriers,and Drain receives them. MOS devices have in fact 4 terminals: Source,Drain,Gate,Substrate (bulk) Q Metal D Source (S) Gate (G) Drain (D) 0 0 Q Oxide (SiO2) Metal Oxide (SiO2) (thickness fax) Source region Channel n n region -L p-type substrate p-type substrate (Body) (Body) Channel region B Body Drain region (B) (a) (b) Microelectronic Circuits,2004 Oxford University Press 心2西/

2020/3/7 4 SM 13 EECE 488 ± Set 1: Introduction and Background Physical Structure - 1 ‡ Source and Drain terminals are identical except that Source provides charge carriers, and Drain receives them. ‡ MOS devices have in fact 4 terminals: ± Source, Drain, Gate, Substrate (bulk) © Microelectronic Circuits, 2004 Oxford University Press

Physical Structure -2 Charge Carriers are electrons in NMOS devices,and holes in PMOS devices. 。 Electrons have a higher mobility than holes So,NMOS devices are faster than PMOS devices We rather to have a p-type substrate?! G Poly Oxide Lp:Due to Side Diffusion Poly-silicon used instead of Metal for fabrication reasons p-substrate drawn -Lo Actual length of the channel (Lef)is less than the length of gate 西/7

SM2020/3/7 5 14 EECE 488 ± Set 1: Introduction and Background Physical Structure - 2 LD: Due to Side Diffusion Poly-silicon used instead of Metal for fabrication reasons ‡ Actual length of the channel (Leff) is less than the length of gate ‡ Charge Carriers are electrons in NMOS devices, and holes in PMOS devices. ‡ Electrons have a higher mobility than holes ‡ So, NMOS devices are faster than PMOS devices ‡ We rather to have a p-type substrate?!

Physical Structure-3 N-wells allow both NMOS and PMOS devices to reside on the same piece of die. n-substrate (a) p-substrate (h) As mentioned,NMOS and PMOS devices have 4 terminals: Source,Drain,Gate,Substrate (bulk) In order to have all PN junctions reverse-biased,substrate of NMOS is connected to the most negative voltage,and substrate of PMOS is connected to the most positive voltage. 4西/d 6

2020/3/7 6 SM 15 EECE 488 ± Set 1: Introduction and Background Physical Structure - 3 ‡ N-wells allow both NMOS and PMOS devices to reside on the same piece of die. ‡ As mentioned, NMOS and PMOS devices have 4 terminals: Source, Drain, Gate, Substrate (bulk) ‡ In order to have all PN junctions reverse-biased, substrate of NMOS is connected to the most negative voltage, and substrate of PMOS is connected to the most positive voltage

Physical Structure -4 MOS transistor Symbols: NMOS PMOS NMOS PMOS NMOS PMOS D D D Go- …0B (a) (b) (e】 。In NMOS Devices:Source-cleciron→Drain Current flows from Drain to Source ·In PMOS Devices:Source-_hoe→Drain Current flows from Source to Drain 。 Current flow determines which terminal is Source and which one is Drain.Equivalently,source and drain can be determined based on their relative voltages. 西/

2020/3/7 7 SM 16 EECE 488 ± Set 1: Introduction and Background Physical Structure - 4 ‡ MOS transistor Symbols: ‡ In NMOS Devices: Current flows from Drain to Source ‡ In PMOS Devices: Current flows from Source to Drain ‡ Current flow determines which terminal is Source and which one is Drain. Equivalently, source and drain can be determined based on their relative voltages. Source Drain electron o Source Drain hole o

Threshold Voltage -1 Consider an NMOS:as the gate voltage is increased,the surface under the gate is depleted.If the gate voltage increases more, free electrons appear under the gate and a conductive channel is formed. 40.1V 40.1V +0.1V n p-substrate p-substrate Negative lons b +0.1V +0.1V p-substrate p-substrate Electrons c (a)An NMOS driven by a gate voltage,(b)formation of depletion region,(c)onset of inversion, and(d)channel formation As mentioned before,in NMOS devices charge carriers in the channel under the gate are electrons. 2西7

2020/3/7 8 SM 17 EECE 488 ± Set 1: Introduction and Background Threshold Voltage - 1 (a) An NMOS driven by a gate voltage, (b) formation of depletion region, (c) onset of inversion, and (d) channel formation ‡ Consider an NMOS: as the gate voltage is increased, the surface under the gate is depleted. If the gate voltage increases more, free electrons appear under the gate and a conductive channel is formed. ‡ As mentioned before, in NMOS devices charge carriers in the channel under the gate are electrons

Threshold Voltage -2 Intuitively,the threshold voltage is the gate voltage that forces the interface(surface under the gate)to be completely depleted of charge (in NMOS the interface is as much n-type as the substrate is p-type) Increasing gate voltage above this threshold (denoted by VTH or V) induces an inversion layer(conductive channel)under the gate. Gate electrode Induced G n-type D Oxide (SiO,) channel p-type substrate Depletion region 专 Microelectronic Circuits,2004 Oxford University Press 心2西月日

2020/3/7 9 SM 18 EECE 488 ± Set 1: Introduction and Background Threshold Voltage - 2 ‡ Intuitively, the threshold voltage is the gate voltage that forces the interface (surface under the gate) to be completely depleted of charge (in NMOS the interface is as much n-type as the substrate is p-type) ‡ Increasing gate voltage above this threshold (denoted by VTH or Vt ) induces an inversion layer (conductive channel) under the gate. © Microelectronic Circuits, 2004 Oxford University Press

Threshold Voltage -3 Analytically: %m=s+2-m+2 Where: ΦMs=Built-in Potential=Φgate-Silicon the difference between the work functions of the polysilico n gate and the silicon substrate Work Function (electrostaticpotentiai)-K n. Qn=Charge in the depletion region=V4:q:s。·Φ,N 西/司 10

2020/3/7 10 SM 19 EECE 488 ± Set 1: Introduction and Background Threshold Voltage - 3 Analytically: ox dep TH MS F C Q V )  2 )  Where: the polysilicon gate and the silicon substrate the difference between the work functions of Built -inPotential )MS )gate  )Silicon ¸ ¸ ¹ · ¨ ¨ © § ) i sub F n N q K T Work Function (electrostatic potential) ln Qdep q si F Nsub Charge in the depletion region 4 H )

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